Vol. 50, No. 1, 2021
Influence of Deposition Conditions and Ion-Plasma Treatment of Thin Cobalt Films on Their Electrical Resistivity
p. 1 abstract
Metallization of Vias in Silicon Wafers to Produce Three-Dimensional Microstructures
p. 8 abstract
Influence of Resist Spreading during Its Dry Electron-Beam Etching on a Lateral Resolution
p. 19 abstract
Kinetics of the Volumetric and Heterogeneous Processes in the Plasma of a C4F8 + O2 + Ar Mixture
p. 24 abstract
Modification of Diazoquinone-Novolac Photoresist Films by the Implantation of Antimony Ions
p. 33 abstract
Effect of a Mixture’s Composition on the Electrophysical Parameters and Emission Spectra of Hydrogen Chloride Plasma with Chlorine and Helium
p. 39 abstract
Experimental Study of the Influence of the Porosity of Thin-Film Silicon-Based Anodes on Their Charge-Discharge Characteristics
p. 45 abstract
Numerical Simulation of Cryogenic Etching: Model with Delayed Desorption
p. 54 abstract
Effect of Process-Related Impurities on the Electrophysical Parameters of a MOS Transistor
p. 63 abstract
Domain Wall Precession in a Narrow Magnetic Nanowire
p. 69 abstract